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Part: DG1111C
Category:
Optoelectronics
-> Display
-> LEDs
-> LED Lamps
Description: PKG Type = Ultra Compact (1608/0603) ;; Emitted Color = Green ;; Lens Type = Diffused ;; Peak Wavelength λ P (nm) = 522 ;; Luminous Intensity iv (mcd) Min = 24.0 ;; Luminous Intensity iv (mcd) TYP = 40.0 ;; Luminous Intensity iv (mcd) Max = 10 ;; Viewing Angle (2 θ 1/2) = 130
Company: Stanley Electric
Datasheet: Download DG1111C datasheet File size : 146 kB
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Datasheet text preview:
Product Guide Product
D_1111C Series, Ultra Compact InGaN/SiC SMT LED
s Features
· High brightness (InGaN/SiC) die material · Available in green (525nm), bluish-green (505nm) · and blue (470nm) colors · Wide 130 degree viewing angle · Reflow and dip soldering compatible · 1000V minimum ESD protection
s Applications
· Portable phone key pad backlight · Various other backlight uses
s Outline Dimensions
Epoxy
PCB
PCB Warpage direction
Unit: mm Tolerances + 0.1
s Electro-Optical Characteristics
Part No. Material Emitted Lens Color Color
InGaN/SiC
Green
(Ta=25°C) Wavelength
Peak p TYP. Spectral Line Dominant Half Width d TYP. TYP. IF
Luminous Intensity IV
MIN. TYP. IF
Forward Voltage V
TYP. MAX.
F
Reverse Viewing Current IR Angle
IF MAX. VR
(2 1/2)
DG1111C DC1111C DB1111C
InGaN/SiC Bluish-Green InGaN/SiC
Blue
24 Milky 24 White 8.5
40 34 14
10 10 10 mA
522 502 467
525 505 470 nm
30 30 26
10 10 10 mA
3.3 3.3 3.3 V
3.8 3.8 3.8
10 10 10 mA
100 100 100 µA
5 5 5 V Deg. 130°
Units
mcd
s Absolute Maximum Ratings
Green Bluish-Green DC 76 20 48 5 -40 to +85 -40 to +100 0.28 (DC) 0.69 (Pulse) Blue
(Ta=25°C)
Item Symbol
Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg IF DG 76 20 48 5 DB 76 20 48 5
Units
mW mA mA V °C °C mA/°C
* Ta=25°C, IFM applies for the pulse width 1msec. and duty cycle 1/20.
s Taping Specifications
1.5 +0.1 0 1.75+0.1
s Operation Current Derating Chart (DC)
4 + 0.1
(1)
(0.2)
Center Hole
8 + 0.2
Quantity on tape: 4000 pieces per reel
( 0.5) Center Hole
2+ 0.05 4+0.1
3.5+0.05
(1.85)
(0.9)
Direction to pull
21+0.8
2+0.5
+1 60 -0 13+0.2
DG, DC, DB,
13+0.2
9+0.3 11.4+1
+0 180 3
s Precautions
Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: · Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. · Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. · Reflow Soldering:
°C Operation Heating 240 r Temperature ise: 5°C/sec. -- Cooling: 5°C/sec. LED Surface Temperature
Spatial Distribution
150 120
Pre-heating
s
2. Cleaning: · If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. · Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. · Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGD1111C-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Ir vine, CA 92606 · Tel: 800-LED-LCD1 (533-5231) · Fax: 949-222-0555 Website: www.stanley-electric.com
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