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Part: IXFR180N10
Category: Discrete -> Transistors -> FETs (Field Effect Transistors) -> MOSFETs -> N-Channel
Description: 100V HiperFET Power MOSFET
Company: IXYS Corporation
Datasheet: Download IXFR180N10 datasheet File size : 585 kB
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Datasheet text preview:
HiPerFETTM Power MOSFETs IXFR 180N10 VDSS = 100 ISOPLUS247TM ID25 = 165
(Electrically Isolated Back Surface) Single MOSFET Die
Preliminary data
RDS(on) =
V A 8 mW
trr £ 250 ns
Symbol VDSS VDGR VG S VGSM ID25 ID(RMS) IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL VISOL Weight
Test Conditions T J = 25°C to 150°C T J = 25°C to 150°C; RGS = 1 MW Continuous Transient TC = 25°C (MOSFET chip capability) External lead (current limit) TC = 25°C, Note 1 TC = 25°C TC = 25°C TC = 25°C IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS T J £ 150°C, RG = 2 W TC = 25°C
Maximum Ratings 100 100 ±20 ±30 165 76 720 180 60 3 5 400 -55 ... +150 150 -55 ... +150 V V V V A A A A mJ J V/ns
ISOPLUS 247TM
G
D
Isolated back surface* G = Gate S = Source * Patent pending D = Drain
Features W °C °C °C °C V~ g · Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation · Low drain to tab capacitance(<25pF) · Low RDS (on) HDMOSTM process · Rugged polysilicon gate cell structure · Unclamped Inductive Switching (UIS) rated · Fast intrinsic Rectifier Applications · DC-DC converters · Battery chargers · Switched-mode and resonant-mode power supplies · DC choppers · AC motor control Advantages · Easy assembly · Space savings · High power density
1.6 mm (0.063 in.) from case for 10 s 50/60 Hz, RMS t = 1 min
300 2500 5
Symbol
Test Conditions
Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 100 2.0 V 4.0 V ±100 nA TJ = 25°C TJ = 125°C 100 mA 2 mA 8 mW
V DSS V GS(th) I GSS IDSS RDS(on)
VGS = 0 V, ID = 3mA VDS = VGS, ID = 8mA VGS = ±20 V, VDS = 0 VDS = VDSS V GS = 0 V VGS = 10 V, ID = 90A Note 1
IXYS reserves the right to change limits, test conditions, and dimensions.
98584A (7/00)
© 2000 IXYS All rights reserved
1-2
IXFR 180N10
Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. Note 2 60 90 9400 VGS = 0 V, VDS = 25 V, f = 1 MHz 3200 1660 50 VGS = 10 V, VDS = 0.5 · VDSS, ID = 90A RG = 1 W (External), 90 140 65 400 VGS = 10 V, VDS = 0.5 · VDSS, ID = 90A 65 220 0.30 0.15 S pF pF pF ns ns ns ns nC nC nC K/W K/W
Dim. Millimeter Min. Max. A 4.83 5.21 A1 2.29 2.54 A2 1.91 2.16 b 1.14 1.40 1.91 2.13 b1 b2 2.92 3.12 C 0.61 0.80 D 20.80 21.34 E 15.75 16.13 e 5.45 BSC L 19.81 20.32 L1 3.81 4.32 Q 5.59 6.20 R 4.32 4.83 S 13.21 13.72 T 15.75 16.26 U 1.65 3.03 Inches Min. Max. .190 .205 .090 .100 .075 .085 .045 .055 .075 .084 .115 .123 .024 .031 .819 .840 .620 .635 .215 BSC .780 .800 .150 .170 .220 .244 .170 .190 .520 .540 .620 .640 .065 .080 1 Gate, 2 Drain (Collector) 3 Source (Emitter) 4 no connection
ISOPLUS 247 (IXFR) OUTLINE
gf s C iss Coss Crss td(on) tr td(off) tf Qg(on) Q gs Qgd RthJC RthCK
VDS = 10 V; ID = 90A
Source-Drain Diode Symbol IS ISM VSD t rr QRM IRM Test Conditions V GS = 0 V Repetitive; pulse width limited by TJM IF = 100A, VGS = 0 V, Note 1
Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 180 720 1.5 250 A A V ns mC A
IF = 50A,-di/dt = 100 A/ms, VR = 100 V
1.1 13
Note: 1. Pulse width limited by TJM 2. Pulse test, t £ 300 ms, duty cycle d £ 2 %
© 2000 IXYS All rights reserved
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
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