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Part: IXDN404SI-16
Category:
Discrete
-> Transistors
-> Power Integrated Ics
Description: 4Amp Dual Low-side Ultrafast MOSFET Driver
Company: IXYS Corporation
Datasheet: Download IXDN404SI-16 datasheet File size : 373 kB
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Datasheet text preview:
IXDN404 / IXDI404 / IXDF404
4 Ampere Dual Low-Side Ultrafast MOSFET Drivers Features
· Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes · Latch-Up Protected Over Entire Operating Range · High Peak Output Current: 4A Peak · Wide Operating Range: 4.5V to 35V · High Capacitive Load Drive Capability: 1800pF in <15ns · Matched Rise And Fall Times · Low Propagation Delay Time · Low Output Impedance · Low Supply Current · Two Drivers in Single Chip
General Description
The IXDN404/IXDI404/IXDF404 is comprised of two 4 Ampere CMOS high speed MOSFET drivers. Each output can source and sink 4A of peak current while producing voltage rise and fall times of less than 15ns to drive the latest IXYS MOSFETs and IGBT's. The input of the driver is compatible with TTL or CMOS and is fully immune to latch up over the entire operating range. A patent-pending circuit virtually eliminates CMOS power supply cross conduction and current shoot-through. Improved speed and drive capabilities are further enhanced by very low, matched rise and fall times. The IXDN404 is configured as a dual non-inverting gate driver, the IXDI404 is a dual inverting gate driver, and the IXDF404 is a dual inverting + non-inverting gate driver. The IXDN404/IXDI404/IXDF404 family are available in the standard 8 pin P-DIP (PI), SOIC-8 (SIA) and SOIC-16 (SIA-16) packages. For enhanced thermal performance, the SOP-8 and SOP-16 are also available in a package with an exposed grounded metal back as the SI and SI-16 repectively.
Applications
· · · · · · · · · · Driving MOSFETs and IGBTs Motor Controls Line Drivers Pulse Generators Local Power ON/OFF Switch Switch Mode Power Supplies (SMPS) DC to DC Converters Pulse Transformer Driver Class D Switching Amplifiers Limiting di/dt Under Short Circuit
Ordering Information
Part Number IXDN404PI IXDN404SI IXDN404SIA IXDN404SI-16 IXDN404SIA-16 IXDI404PI IXDI404SI IXDI404SIA IXDI404SI-16 IXDI404SIA-16 IXDF404PI IXDF404SI IXDF404SIA IXDF404SI-16 IXDF404SIA-16 Package Type 8-Pin PDIP 8-Pin SOIC with Grounded Metal Back 8-Pin SOIC 16-Pin SOIC with Grounded Metal Back 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC with Grounded Metal Back 8-Pin SOIC 16-Pin SOIC with Grounded Metal Back 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC with Grounded Metal Back 8-Pin SOIC 16-Pin SOIC with Grounded Metal Back 16-Pin SOIC Temp. Range -55°C to +125°C Configuration Dual Non Inverting
-55°C to +125°C
Dual Inverting
-55°C to +125°C
Inverting + Non Inverting
NOTE: Mounting or solder tabs on all packages are connected to ground
Copyright © IXYS CORPORATION 2003
First Release
IXDN404 / IXDI404 / IXDF404
Figure 1 - IXDN404 Dual 4A Non-Inverting Gate Driver Functional Block Diagram
Vcc
IN A
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT A N
IN B
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT B N
GND
Figure 2 - IXDI404 Dual Inverting 4A Gate Driver Functional Block Diagram
Vcc
IN A
ANTI-CROSS CONDUCTION CIRCU IT *
P OUT A N
IN B
ANTI-CROSS CONDUCTION CIRCU IT *
P OUT B N
G ND
Figure 3 - IXDF404 Inverting + Non-Inverting 4A Gate Driver Functional Block Diagram
Vcc
IN A
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT A N
IN B
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT B N
* Patent Pending
GND
2
IXDN404 / IXDI404 / IXDF404 Absolute Maximum Ratings (Note 1)
Parameter Supply Voltage All Other Pins Junction Temperature Storage Temperature Value 40V -0.3V to VCC + 0.3V 150oC -65oC to 150oC 300oC
Operating Ratings
Parameter
Operating Temperature Range -55 oC to 125 oC
Value
Soldering Lead Temperature (10 seconds maximum) Thermal Resistance (Junction to Case) (JC) 8 Pin SOIC (SI) 10 K/W 16 Pin SOIC (SI-16) 10 K/W
Electrical Characteristics
Symbol VIH VIL VIN IIN VOH VOL ROH ROL IPEAK IDC tR tF tONDLY tOFFDLY VCC ICC Parameter High input voltage Low input voltage Input voltage range Input current High output voltage Low output voltage Output resistance @ Output High Output resistance @ Output Low Peak output current Continuous output current Rise time Fall time On-time propagation delay Off-time propagation delay Power supply voltage Power supply current VCC = 18V VCC = 18V VCC = 18V 0V VIN VCC Test Conditions
Thermal Resistance (To Ambient) 8 Pin PDIP (PI) (JA) 120 K/W 8 Pin SOIC (SIA) 110 K/W 110 K/W 16 Pin SOIC (SIA-16) (JA) JA with heat sink ** Heat sink area of 1 cm2 8 Pin SOIC 95 K/W 16 Pin SOIC-CT 95 K/W 2 Heat sink area of 3 cm 8 Pin SOIC 85 K/W 16 Pin SOIC-CT 85 K/W ** Device soldered to metal back pane. Heat sink area is 1 oz. copper on 1 side of 0.06" thick FR4 PC board.
Unless otherwise noted, TA = 25 oC, 4.5V VCC 35V . All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel.
Min 2.5
Typ
Max 1.5
Units V V V µA V
-5 -10 VCC - 0.025
VCC + 0.3 10
0.025 2 1.5 4 1 CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V 4.5 VIN = 3.5V VIN = 0V VIN = + VCC 16 13 36 35 18 1 0 18 17 40 39 35 3 10 10 2.5 2
V A A ns ns ns ns V mA µA µA
Specifications Subject To Change Without Notice
Note 1: Operating the device beyond parameters with listed "Absolute Maximum Ratings" may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
3
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