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Part: IXDN402SI-16
Category:
Discrete
-> Transistors
-> Power Integrated Ics
Description: 2Amp Dual Low-side Ultrafast MOSFET Driver
Company: IXYS Corporation
Datasheet: Download IXDN402SI-16 datasheet File size : 373 kB
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Datasheet text preview:
IXDN402 / IXDI402 / IXDF402
2 Ampere Dual Low-Side Ultrafast MOSFET Drivers
Features
· Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes · Latch-Up Protected Over Entire Operating Range · High Peak Output Current: 2A Peak · Wide Operating Range: 4.5V to 35V · -55°C to +125°C Extended Operating Temperature Standard · High Capacitive Load Drive Capability: 1000pF in <10ns · Matched Rise And Fall Times · Low Propagation Delay Time · Low Output Impedance · Low Supply Current · Two Drivers in Single Chip
General Description
The IXDN402/IXDI402/IXDF402 consists of two 2 Amp CMOS high speed MOSFET drivers. Each output can source and sink 2A of peak current while producing voltage rise and fall times of less than 15ns to drive the latest IXYS MOSFETs & IGBTs. The input of the driver is TTL or CMOS compatible and is fully immune to latch up over the entire operating range. A patent-pending circuit virtually eliminates cross conduction and current shoot-through. Improved speed and drive capabilities are further enhanced by very low and matched rise and fall times. The IXDN402 is configured as a dual non-inverting gate driver, the IXDI402 as a dual inverting gate driver, and the IXDF402 as a dual inverting + non-inverting gate driver. The IXDN402/IXDI402/IXDF402 family are available in the standard 8 pin P-DIP (PI), SOIC-8 (SIA) and SOIC-16 (SIA16) packages. For enhanced thermal performance, the SOIC-8 and SOIC-16 are also available with an exposed grounded backmetal package as the SI and SI-16 respectively.
Applications
· · · · · · · · · Driving MOSFETs and IGBTs Motor Controls Line Drivers Pulse Generators Local Power ON/OFF Switch Switch Mode Power Supplies (SMPS) DC to DC Converters Pulse Transformer Driver Class D Switching Amplifiers Ordering Information
Part Number Package Type Temp. Range IXDN402PI 8-Pin PDIP IXDN402SI 8-Pin SOIC with Grounded Backmetal -55°C to IXDN402SIA 8-Pin SOIC +125°C IXDN402SI-16 16-Pin SOIC with Grounded Backmetal IXDN402SIA-16 16-Pin SOIC IXDI402PI 8-Pin PDIP IXDI402SI 8-Pin SOIC with Grounded Backmetal -55°C to IXDI402SIA 8-Pin SOIC +125°C IXDI402SI-16 16-Pin SOIC with Grounded Backmetal IXDI402SIA-16 16-Pin SOIC IXDF402PI 8-Pin PDIP IXDF402SI 8-Pin SOIC with Grounded Backmetal -55°C to IXDF402SIA 8-Pin SOIC +125°C IXDF402SI-16 16-Pin SOIC with Grounded Backmetal IXDF402SIA-16 16-Pin SOIC NOTE: Mounting or solder tabs on all packages are connected to ground
Configuration Dual Non Inverting
Dual Inverting
Inverting + Non Inverting
Copyright © IXYS CORPORATION 2003
First Release
IXDN402 / IXDI402 / IXDF402
Figure 1 - IXDN402 Dual 2A Non-Inverting Gate Driver Functional Block Diagram
Vcc
IN A
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT A N
IN B
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT B N
GND
Figure 2 - IXDI402 Dual Inverting 2A Gate Driver Functional Block Diagram
Vcc
IN A
ANTI-CROSS CONDUCTION CIRCU IT *
P OUT A N
IN B
ANTI-CROSS CONDUCTION CIRCU IT *
P OUT B N
G ND
Figure 3 - IXDF402 Inverting + Non-Inverting 2A Gate Driver Functional Block Diagram
Vcc
IN A
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT A N
IN B
ANTI-CROSS CONDUCTION CIRCUIT *
P OUT B N
GND
* Patent Pending
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IXDN402 / IXDI402 / IXDF402 Absolute Maximum Ratings (Note 1)
Parameter Supply Voltage All Other Pins Junction Temperature Storage Temperature Lead Temperature (10 sec) Value 40 V -0.3 V to VCC + 0.3 V 150 oC -65 oC to 150 oC 300 oC
Operating Ratings
Parameter
Operating Temperature Range -55 oC to 125 oC
Value
Thermal Resistance (Junction to Case) (JC) 8 Pin SOIC (SI) 10 K/W 16 Pin SOIC (SI-16) 10 K/W
Thermal Resistance (To Ambient) 130 K/W 8 Pin PDIP (PI) (JA) 8 Pin SOIC (SIA) 120 K/W 16 Pin SOIC (SIA-16) (JA) 120 K/W JA with heat sink ** Heat sink area of 1 cm2 8 Pin SOIC 100 K/W 16 Pin SOIC-CT 100 K/W 2 Heat sink area of 3 cm 8 Pin SOIC 90 K/W 16 Pin SOIC-CT 90 K/W ** Device soldered to metal back pane. Heat sink area is 1 oz. copper on 1 side of 0.06" thick FR4 PC board.
Electrical Characteristics
Unless otherwise noted, TA = 25 oC, 4.5V VCC 35V . All voltage measurements with respect to GND. IXDD402 configured as described in Test Conditions. All specifications are for one channel.
Symbol VIH VIL VIN IIN VOH VOL ROH ROL IPEAK IDC tR tF tONDLY tOFFDLY VCC ICC
Parameter High input voltage Low input voltage Input voltage range Input current High output voltage Low output voltage Output resistance @ Output high Output resistance @ Output Low Peak output current Continuous output current Rise time Fall time On-time propagation delay Off-time propagation delay Power supply voltage Power supply current
Test Conditions
Min 3
Typ
Max 2.4
Units V V V µA V
-5 0V VIN VCC -10 VCC - 0.025
VCC + 0.3 10
0.025 VCC = 18V VCC = 18V VCC is 18V 3.7 2.5 2 1 CL=1000pF Vcc=18V CL=1000pF Vcc=18V CL=1000pF Vcc=18V CL=1000pF Vcc=18V 4.5 VIN = 3.5V VIN = 0V VIN = + VCC 8 8 28 26 18 1 0 10 9 32 30 35 3 10 10 4 3
V A A ns ns ns ns V mA µA µA
Specifications Subject To Change Without Notice
Note 1: Operating the device beyond the parameters listed as "Absolute Maximum Ratings" may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
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