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Part: HY5DU281622DLT-X
Category: Memory -> DRAM -> DDR SDRAM -> 128 Mb
Description:
Company: Hynix Semiconductor
Datasheet: Download HY5DU281622DLT-X datasheet File size : 908 kB
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HY5DU28422D(L)T HY5DU28822D(L)T HY5DU281622D(L)T
128M-S DDR SDRAM
HY5DU28422D(L)T HY5DU28822D(L)T HY5DU281622D(L)T
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 0.2/Aug. 02 1
HY5DU28422D(L)T HY5DU28822D(L)T HY5DU281622D(L)T
Revision History
1. Revision 0.1 (May 02)
1) Define Preliminary Sepcification
2. Revision 0.2 (Aug 02)
1) Define IDD Sepcification
Rev. 0.2/Aug. 02
2
HY5DU28422D(L)T HY5DU28822D(L)T HY5DU281622D(L)T DESCRIPTION
PRELIMINARY
The Hynix HY5DU28422D(L)T, HY5DU28822D(L)T and HY5DU281622D(L)T are a 134,217,728-bit CMOS Double Data Rate(DDR) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. The Hynix 128Mb DDR SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the /CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All input and output voltage levels are compatible with SSTL_2.
FEATURES
· · · · · · VDD, VDDQ = 2.5V +/- 0.2V All inputs and outputs are compatible with SSTL_2 interface Fully differential clock inputs (CK, /CK) operation Double data rate interface Source synchronous - data transaction aligned to bidirectional data strobe (DQS) Data outputs on DQS edges when read (edged DQ) Data inputs on DQS centers when write (centered DQ) On chip DLL align DQ and DQS transition with CK transition DM mask write data-in at the both rising and falling edges of the data strobe tRAS Lock-out function supported · · · · · · · · All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock Programmable /CAS latency 2 and 2.5 supported Programmable burst length 2 / 4 / 8 with both sequential and interleave mode Internal four bank operations with single pulsed /RAS Auto refresh and self refresh supported 4096 refresh cycles / 64ms JEDEC standard 400mil 66pin TSOP-II with 0.65mm pin pitch Full and Half strength driver option controlled by EMRS
· · ·
ORDERING INFORMATION
Part No.
HY5DU28422D(L)T-X* HY5DU28822D(L)T-X* HY5DU281622D(L)T-X*
OPERATING FREQUENCY
PACKAGE
400mil 66pin TSOP-II
Configuration
32Mx4 16Mx8 8Mx16
Grade
-J -M -K -H -L
CL2
133MHz 133MHz 133MHz 100MHz 100MHz
CL2.5
166MHz 133MHz 133MHz 133MHz 125MHz
Remark (CL-tRCD-tRP)
DDR333 (2.5-3-3) DDR266 (2-2-2) DDR266A (2-3-3) DDR266B (2.5-3-3) DDR200 (2-2-2)
* X means speed grade
Rev. 0.2/Aug. 02
3
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