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Part: EP2A90

Category:
 FPGAs/PLDs
   -> PLDs (Programmable Logic Devices)
     -> SPLDs (Simple PLD)
             -> APEX II

Description:

Company: Altera Corporation

Datasheet: Download EP2A90 datasheet     File size : 422 kB

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Datasheet text preview:
APEX II
®

Programmable Logic Device Family
Data Sheet

August 2002, ver. 3.0

Features...







Programmable logic device (PLD) manufactured using a 0.15-µm alllayer copper-metal fabrication process (up to eight layers of metal) ­ 1-gigabit per second (Gbps) True-LVDSTM, LVPECL, pseudo current mode logic (PCML), and HyperTransportTM interface ­ Clock-data synchronization (CDS) in True-LVDS interface to correct any fixed clock-to-data skew ­ Enables common networking and communications bus I/O standards such as RapidIOTM, CSIX, Utopia IV, and POS-PHY Level 4 ­ Support for high-speed external memory interfaces, including zero bus turnaround (ZBT), quad data rate (QDR), and double data rate (DDR) static RAM (SRAM), and single data rate (SDR) and DDR synchronous dynamic RAM (SDRAM) ­ 30% to 40% faster design performance than APEXTM 20KE devices on average ­ Enhanced 4,096-bit embedded system blocks (ESBs) implementing first-in first-out (FIFO) buffers, Dual-Port+ RAM (bidirectional dual-port RAM), and content-addressable memory (CAM) ­ High-performance, low-power copper interconnect ­ Fast parallel byte-wide synchronous device configuration ­ Look-up table (LUT) logic available for register-intensive functions High-density architecture ­ 1,900,000 to 5,250,000 maximum system gates (see Table 1) ­ Up to 67,200 logic elements (LEs) ­ Up to 1,146,880 RAM bits that can be used without reducing available logic Low-power operation design ­ 1.5-V supply voltage ­ Copper interconnect reduces power consumption ­ MultiVoltTM I/O support for 1.5-V, 1.8-V, 2.5-V, and 3.3-V interfaces ­ ESBs offer programmable power-saving mode

Altera Corporation
DS-APEXII-3.0

1

APEX II Programmable Logic Device Family Data Sheet

Table 1. APEX II Device Features Feature
Maximum gates Typical gates LEs RAM ESBs Maximum RAM bits True-LVDS channels Flexible-LVDSTM channels (2) True-LVDS PLLs (3) General-purpose PLL outputs (4) Maximum user I/O pins Notes to Table 1:
(1) (2) (3) (4) Each device has 36 input channels and 36 output channels. EP2A15 and EP2A25 devices have 56 input and 56 output channels; EP2A40 and EP2A70 devices have 88 input and 88 output channels. PLL: phase-locked loop. True-LVDS PLLs are dedicated to implement True-LVDS functionality. Two internal outputs per PLL are available. Additionally, the device has one external output per PLL pair (two external outputs per device).

EP2A15
1,900,000 600,000 16,640 104 425,984 36 (1) 56 4 8 492

EP2A25
2,750,000 900,000 24,320 152 622,592 36 (1) 56 4 8 612

EP2A40
3,000,000 1,500,000 38,400 160 655,360 36 (1) 88 4 8 735

EP2A70
5,250,000 3,000,000 67,200 280 1,146,880 36 (1) 88 4 8 1,060

...and More Features



I/O features ­ Up to 380 Gbps of I/O capability ­ 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport support on 36 input and 36 output channels that feature clock synchronization circuitry and independent clock multiplication and serialization/deserialization factors ­ Common networking and communications bus I/O standards such as RapidIO, CSIX, Utopia IV, and POS-PHY Level 4 enabled ­ 400-megabits per second (Mbps) Flexible-LVDS and HyperTransport support on up to 88 input and 88 output channels (input channels also support LVPECL) ­ Support for high-speed external memories, including ZBT, QDR, and DDR SRAM, and SDR and DDR SDRAM ­ Compliant with peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 33 or 66 MHz and 32 or 64 bits ­ Compliant with 133-MHz PCI-X specifications ­ Support for other advanced I/O standards, including AGP, CTT, SSTL-3 and SSTL-2 Class I and II, GTL+, and HSTL Class I and II ­ Six dedicated registers in each I/O element (IOE): two input registers, two output registers, and two output-enable registers ­ Programmable bus hold feature ­ Programmable pull-up resistor on I/O pins available during user mode

2

Altera Corporation

APEX II Programmable Logic Device Family Data Sheet











Programmable output drive for 3.3-V LVTTL at 4 mA, 12 mA, 24 mA, or I/O standard levels ­ Programmable output slew-rate control reduces switching noise ­ Hot-socketing operation supported ­ Pull-up resistor on I/O pins before and during configuration Enhanced internal memory structure ­ High-density 4,096-bit ESBs ­ Dual-Port+ RAM with bidirectional read and write ports ­ Support for many other memory functions, including CAM, FIFO, and ROM ­ ESB packing mode partitions one ESB into two 2,048-bit blocks Device configuration ­ Fast byte-wide synchronous configuration minimizes in-circuit reconfiguration time ­ Device configuration supports multiple voltages (either 3.3 V and 2.5 V or 1.8 V) Flexible clock management circuitry with eight general-purpose PLL outputs ­ Four general-purpose PLLs with two outputs per PLL ­ Built-in low-skew clock tree ­ Eight global clock signals ­ ClockLockTM feature reducing clock delay and skew ­ ClockBoostTM feature providing clock multiplication (by 1 to 160) and division (by 1 to 256) ­ ClockShiftTM feature providing programmable clock phase and delay shifting with coarse (90°, 180°, or 270°) and fine (0.5 to 1.0 ns) resolution Advanced interconnect structure ­ All-layer copper interconnect for high performance ­ Four-level hierarchical FastTrack® interconnect structure for fast, predictable interconnect delays ­ Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions) ­ Dedicated cascade chain that implements high-speed, high-fan-in logic functions (automatically used by software tools and megafunctions) ­ Interleaved local interconnect allowing one LE to drive 29 other LEs through the fast local interconnect Advanced software support ­ Software design support and automatic place-and-route provided by the Altera® QuartusTM II development system for Windows-based PCs, Sun SPARCstations, and HP 9000 Series 700/800 workstations ­ Altera MegaCore® functions and Altera Megafunction Partners Program (AMPPSM) megafunctions optimized for APEX II architecture

­

Altera Corporation

3

APEX II Programmable Logic Device Family Data Sheet

­ ­ ­

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LogicLockTM incremental design for intellectual property (IP) integration and team-based design NativeLinkTM integration with popular synthesis, simulation, and timing analysis tools SignalTap® embedded logic analyzer simplifies in-system design evaluation by giving access to internal nodes during device operation Support for popular revision-control software packages, including PVCS, RCS, and SCCS

Tables 2 and 3 show the APEX II ball-grid array (BGA) and FineLine BGATM device package sizes, options, and I/O pin counts. Table 2. APEX II Package Sizes Feature
Pitch (mm) Area (mm 2) Length × Width (mm × mm)

672-Pin FineLine BGA
1.00 729 27 × 27

724-Pin BGA
1.27 1,225 35 × 35

1,020-Pin FineLine BGA
1.00 1,089 33 × 33

1,508-Pin FineLine BGA
1.00 1,600 40 × 40

Table 3. APEX II Package Options & I/O Pin Count Feature
EP2A15 EP2A25 EP2A40 EP2A70 Notes to Table 3:
(1)

Notes (1), (2) 724-Pin BGA
492 536 536 536 735 1,060

672-Pin FineLine BGA
492 492 492

1,020-Pin FineLine BGA

1,508-Pin FineLine BGA

(2)

All APEX II devices support vertical migration within the same package (e.g., the designer can migrate between the EP2A15, EP2A25, and EP2A40 devices in the 672-pin FineLine BGA package). Vertical migration means that designers can migrate to devices whose dedicated pins, configuration pins, LVDS pins, and power pins are the same for a given package across device densities. Migration of I/O pins across densities requires the designer to cross reference the available I/O pins using the device pin-outs. This must be done for all planned densities for a given package type to identify which I/O pins are migratable. I/O pin counts include dedicated clock and fast I/O pins.

4

Altera Corporation

APEX II Programmable Logic Device Family Data Sheet

General Description

APEX II devices integrate high-speed differential I/O support using the True-LVDS interface. The dedicated serializer, deserializer, and CDS circuitry in the True-LVDS interface support the LVDS, LVPECL, HyperTransport, and PCML I/O standards. Flexible-LVDS pins located in regular user I/O banks offer additional differential support, increasing the total device bandwidth. This circuitry, together with enhanced IOEs and support for numerous I/O standards, allows APEX II devices to meet high-speed interface requirements. APEX II devices also include other high-performance features such as bidirectional dual-port RAM, CAM, general-purpose PLLs, and numerous global clocks.

Configuration
The logic, circuitry, and interconnects in the APEX II architecture are configured with CMOS SRAM elements. APEX II devices are reconfigurable and are 100% tested prior to shipment. As a result, test vectors do not have to be generated for fault coverage. Instead, the designer can focus on simulation and design verification. In addition, the designer does not need to manage inventories of different ASIC designs; APEX II devices can be configured on the board for the specific functionality required. APEX II devices are configured at system power-up with data either stored in an Altera configuration device or provided by a system controller. Altera offers in-system programmability (ISP)-capable configuration devices, which configure APEX II devices via a serial data stream. The enhanced configuration devices can configure any APEX II device in under 100 ms. Moreover, APEX II devices contain an optimized interface that permits microprocessors to configure APEX II devices serially or in parallel, synchronously or asynchronously. This interface also enables microprocessors to treat APEX II devices as memory and to configure the device by writing to a virtual memory location, simplifying reconfiguration. APEX II devices also support a new byte-wide, synchronous configuration scheme at speeds of up to 66 MHz using EPC16 configuration devices or a microprocessor. This parallel configuration reduces configuration time by using eight data lines to send configuration data versus one data line in serial configuration. APEX II devices support multi-voltage configuration; device configuration can be performed at 3.3 V and 2.5 V or 1.8 V.

Altera Corporation

5




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