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Part: D2555G34

Category:

Description: Wavelengh-selected Direct Modulated ISOlated DFB Laser Module. Fc-pc Connector. Itu Freq. 193.4 Thz. Center Wavelength 1550.12 Nm. Peak Power 2mW. Dispersion Performance 3000ps/nm(170km).

Company: Agere Systems

Datasheet: Download D2555G34 datasheet     File size : 311 kB

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Data Sheet, Rev. 3 July 2001

D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module
Applications
s

Three direct-modulated DWDM families available to meet a number of OC-48/STM-16 applications: -- Extended reach (100 km) -- Ver y long reach (170 km) -- Metro DWDM -- Digital video

Product Codes
Product Code
The 1.5 µm D2570, D2526G, and D2555 Laser Modules are available in a 14-pin, hermetic, butterfly package.

Peak Power 10 mW 2 mW 2 mW

Dispersion Performance 1800 ps/nm (100 km) 1800 ps/nm (100 km) 3000 ps/nm (170 km)

D2570H D2526G D2555G

Features
s

ITU wavelengths available from 1528.77 nm --1610.06 nm SONET/SDH compatible up to OC-48/STM-16 Temperature tunable for precise wavelength selection Integrated optical isolator High-perfor mance, multiquantum well (MQW) distributed-feedback (DFB) laser Industr y-standard, 14-pin butterfly package Characterized at 2.488 Gbits/s (NRZ) InGaAs, PIN photodetector back-facet monitor Low threshold current High-reliability, hermetic packaging Excellent long-term wavelength stability can eliminate the need for external wavelength locker Qualified to meet the intent of Telcordia Technologies * 468

Description
The Direct Modulated Isolated DFB Laser Module contains an internally cooled, InGaAs, MQW, distributed-feedback (DFB) laser designed for 1.5 µm applications. The following three direct-modulation DWDM product families have been established to meet various OC-48/STM-16 system applications:
s

s s

s s

s s s s s s

D2526-type: designed to be used in OC-48/ STM-16 (2.488 Gbits/s) for extended reach, dense WDM applications (1800 ps/nm). The wavelength of the laser can be temperature-tuned for precise wavelength selection by adjusting the temperature of the internal thermoelectric cooler. D2555-type: high-performance device designed for very low dispersion; used in fiber spans exceeding 170 km (3000 ps/nm). D2570-type: high-power, direct-modulated laser eliminates the need for optical amplifiers in DWDM many applications.

s

s

s

* Telcordia Technologies is a trademark of Telcordia Technologies, Inc.

D2570, D2526G, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module

Data Sheet, Rev. 3 July 2001

Description (continued)
Controlled Feedback
The module contains an internal optical isolator that suppresses optical feedback in laser-based, fiber-optic systems. Light reflected back to the laser is attenuated a minimum of 30 dB.

Pin Information
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 N ame Thermistor Thermistor Laser dc Bias (Cathode) (­) Back-facet Monitor Anode (­) Back-facet Monitor Cathode (+) Ther moelectric Cooler (+)* Ther moelectric Cooler (­) Case Ground Case Ground Case Ground Laser Anode (+) RF Laser Input Cathode (­) Laser Anode (+) Case Ground

Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable thermal characteristics. The TEC allows for heating and cooling of the laser chip to maintain a temperature of 25 °C for case temperatures from ­40 °C to +70 °C. The laser temperature is monitored by the internal thermistor, which can be used with external circuitry to control the laser chip temperature.

Controlled Power
An internal, InGaAs, PIN photodiode functions as the back-facet monitor. The photodiode monitors emission from the rear facet of the laser and, when used in conjunction with control circuitry, can control optical power launched into the fiber. Normally, this configuration is used in a feedback arrangement to maintain consistent laser output power.

* A positive current through the thermoelectric heat pump cools the laser. Both leads should be grounded for optimum performance.

7 ­

6 +

5 +

4 ­ L1 160 nH

3 ­

2

1

TH 10 k

TEC

Standard Package
The laser module is fabricated in a 14-pin, hermetic, metal/ceramic butterfly package that incorporates a bias tee, which separates the dc-bias path from the RF input. The RF input has a nominal 25 impedance. The laser module is equipped with SMF-28 * type fiber. The fiber has a 900 µm tight buffer jacket. Various connectors and pigtail lengths are available. Agere Systems' optoelectronic components are being qualified to rigorous internal standards that are consistent with Telcordia Technologies TR-NWT-000468. All design and manufacturing operations are ISO * 9001 certified. The module is being fully qualified for central office applications.
8

PACKAGE GROUNDS + 9 10 11

R1 20 ­ 12

ISOLATOR NC +

13

14

1-567F.b

Top view.

Figure 1. Circuit Schematic

* ISO is a registered trademark of The International Organization for Standardization. SMF-28 is a trademark of Corning Inc.

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Agere Systems Inc.

Data Sheet, Rev. 3 July 2001

D2570, D2526G, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module

Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Laser Reverse Voltage dc Forward Current Operating Case Temperature Range Storage Case Temperature Range* Photodiode Reverse Voltage Photodiode Forward Current
* Does not apply to shipping container.

Symbol VRLMAX IFLMAX TC Tstg VRPDMAX IFPDMAX

Min -- -- ­40 ­40 -- --

Max 2 150 70 85 10 2

Unit V mA °C °C V mA

Handling Precautions
Power Sequencing
To avoid the possibility of damage to the laser module from power supply switching transients, follow this turnon sequence: 1. All ground connections 2. Most negative supply 3. Most positive supply 4. All remaining connections Reverse the order for the proper turn-off sequence.

Mounting Instructions
The minimum fiber bend radius is 1.23 in (31.25 mm). To avoid degradation in performance, mount the module on the board as follows: 1. Place the bottom flange of the module on a flat heat sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in size. The surface finish of the heat sink should be better than 32 µin. (0.8 µm), and the surface flatness must be better than 0.001 in. (25.4 µm). Using thermal conductive grease is optional; however, thermal performance can be improved by up to 5% if conductive grease is applied between the bottom flange and the heat sink. 2. Mount four #2-56 screws with Fillister heads (M2-3 mm) at the four screw hole locations (see Outline Diagram). The Fillister head diameter must not exceed 0.140 in. (3.55 mm). Do not apply more than 1 in./lb. of torque to the screws.
0.062 (1.58) 0.031 (0.79) 0.140 (3.56) 0.129 (3.28) R 0.041 (1.04)
1-532

Electrostatic Discharge
CAUTION: This device is susceptible to damage as a result of electrostatic discharge. Take proper precautions during both handling and testing. Follow guidelines such as JEDEC Publication No. 108-A (Dec. 1988).

0.118 (3.00) 0.086 (2.18)

Agere Systems employs a human-body model (HBM) for ESD-susceptibility testing and protection-design evaluation. ESD voltage thresholds are dependent on the critical parameters used to define the model. A standard HBM (resistance = 1.5 k¾, capacitance = 100 pF) is widely used and, therefore, can be used for comparison purposes. The HBM ESD threshold presented here was obtained using these circuit parameters: Parameter Human-body Model Agere Systems Inc. Value >400 Un it V

Note: Dimensions are in inches and (millimeters).

Figure 2. Fillister Head Screw

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D2570, D2526G, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module

Data Sheet, Rev. 3 July 2001

D2526 Characteristics
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Table 1. Electrical Characteristics (at 25 °C laser temperature) Parameter Slope Efficiency Threshold Current Laser Forward Voltage Laser Submount Temperature Monitor Reverse-bias Voltage* Monitor Current Monitor Dark Current Input Impedance Thermistor Current Resistance Ratio Thermistor Resistance TEC Current TEC Voltage TEC Capacity Symbol ITH VL F T LA SE R VRMON IRMON ID ZI N IT C -- RTH I TE C V TE C T Test Conditions LF = 2 mW (CW) -- LF = 2 mW (CW) -- -- POL = 1 mW (CW) IF = 0, VRMON = 5 V -- -- -- TL = 25 °C TL = 25 °C, TC = 70 °C TL = 25 °C, TC = 70°C TC = 70 °C M in 0.06 -- -- 20 3 0.1 -- -- 10 9.1 9.5 -- -- -- Typ 0.09 14 1 .3 -- 5 0.3 0.01 25 -- -- -- 0 .6 1.3 -- M ax 0.13 30 1 .8 30 10 1.5 0.1 -- 100 9.6 10.5 1.0 2 .0 50 Unit mW/mA mA V °C V mA µA µA -- k A V °C

* Standard operating condition is 5.0 V reverse bias. Ratio of thermistor resistance at 0 °C to thermistor resistance at 50 °C.

Table 2. Optical Characteristics (at 25 °C laser temperature) Parameter Peak Optical Output Power Center Wavelength (See Table 10.) Line Width (3 dB full width) Side-mode Suppression Ratio Optical Isolation Wavelength Drift (EOL) Center Wavelength Drift with Case Temperature Wavelength Temperature Tuning Coefficient Tracking Error Table 3. Dispersion Performance Parameter Dispersion Penalty for Extended Reach S ym bol DP Test Conditions 1800 ps/nm M in -- Typ -- Max 2.0 Unit dB Symbol PPEAK c Test Conditions Min 2 .0 1528.77 -- 30 30 -- -- -- -- Typ -- -- 2 -- -- -- -- 0.095 -- Max -- 1610.06 10 -- -- ±0.1 1 -- 1 Unit mW nm MHz dB dB nm p m /°C n m /°C dB

-- TL = 25 °C CW wavelength Modulated at 2.5 Gbits/s at rated power SMSR CW -- TC = 0 °C to 70 °C Tested over 25-year lifetime C/TC 0 °C TC 70 °C -- -- -- TC = ­20 °C/25 °C/70 °C

4

Agere Systems Inc.

Data Sheet, Rev. 3 July 2001

D2570, D2526G, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module

D2555 Characteristics
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Table 4. Electrical Characteristics (at 25 °C laser temperature) Parameter Slope Efficiency Threshold Current Laser Forward Voltage Laser Submount Temperature Monitor Reverse-bias Voltage* Monitor Current Monitor Dark Current Input Impedance Ther mistor Current Resistance Ratio Ther mistor Resistance TEC Current TEC Voltage TEC Capacity Symbol IT H V LF TLASER V R MO N IR M O N ID Z IN I TC -- RTH I TEC V TEC T Test Conditions LF = 2 mW (CW) -- LF = 2 mW (CW) -- -- POL = 1 mW (CW) IF = 0, VRMON = 5 V -- -- -- TL = 25 °C TL = 25 °C, TC = 70 °C TL = 25 °C, TC = 70°C TC = 70 °C Min 0.05 -- -- 20 3 0.1 -- -- 10 9.1 9.5 -- -- -- Typ 0.08 12 1.3 -- 5 0.3 0.01 25 -- -- -- 0.6 1.3 -- Max 0.10 35 1 .8 30 10 1 .9 0.1 -- 100 9 .6 10.5 1.0 2.0 50 Unit mW/mA mA V °C V mA µA µA -- k A V °C

* Standard operating condition is 5.0 V reverse bias. Ratio of thermistor resistance at 0 °C to thermistor resistance at 50 °C.

Table 5. Optical Characteristics (at 25 °C laser temperature) Parameter Peak Optical Output Power Center Wavelength (See Table 11.) Line Width (3 dB full width) Side-mode Suppression Ratio Optical Isolation Wavelength Drift (EOL) Center Wavelength Drift with Case Temperature Wavelength Temperature Tuning Coefficient Tracking Error Table 6. Dispersion Performance Parameter Dispersion Penalty for Extended Reach Symbol DP Test Conditions 3000 ps/nm M in -- Typ -- Max 2.0 Unit dB Symbol P P EA K c Test Conditions Min 2 .0 1528.77 -- 30 30 -- -- -- -- Typ -- -- 2 -- -- -- -- 0 .095 -- Max -- 1563.86 10 -- -- ±0 . 1 1 -- 1 Unit mW nm MHz dB dB nm pm/°C nm/°C dB

-- TL = 25 °C CW wavelength Modulated at 2.5 Gbits/s at rated power SMSR CW -- TC = 0 °C to 75 °C Tested over 25-year lifetime C/TC 0 °C TC 75 °C -- -- -- TC = ­20 °C/25 °C/70 °C

Agere Systems Inc.

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