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Part: SAA2501
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INTEGRATED CIRCUITS
DATA SHEET
SAA2501 Digital Audio Broadcast (DAB) decoder
Preliminary specification File under Integrated Circuits, IC01 January 1995
Philips Semiconductors
Philips Semiconductors
Preliminary specification
Digital Audio Broadcast (DAB) decoder
CONTENTS FEATURES 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.17.1 7.17.2 7.17.3 7.17.4 7.18 7.19 7.20 7.20.1 7.20.2 7.20.3 7.20.4 7.20.5 7.20.6 7.20.6.1 7.20.7 7.20.8 7.20.9 7.20.10 7.20.11 7.20.12 APPLICATION GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Coding system Basic functionality SAA2501 clocks Crystal oscillator Clock frequencies when using the slave input Clock frequencies when using the master input Target applications; applying the SAA2501 with 2 ISO/MPEG sources Buffered clock outputs Functionality issues Synchronization to input data bitstreams Master input bit rate selection Sample rate selection Handling of errors in the coded input data sub-band filter signals Baseband audio processing Decoding control signals Coded data interfaces The coded data master input interface The coded data slave input interface Slave input transfer speed of first frame Slave input transfer speed of subsequent frames The sub-band filter interface The baseband output interface The L3 control interface L3 signals L3 transfer types L3 interface initialization at an SAA2501 device reset L3 interface control SAA2501 status Data items General data items SAA2501 settings item Input data frame header items Error report item Audio service synchronized data item Ancillary Data/XPAD item APU coefficients item 7.20.13 7.20.14 8 8.1 8.1.1 8.1.1.1 8.1.1.2 8.1.1.3 8.1.1.4 8.1.2 8.1.3 8.1.3.1 8.1.3.2 8.1.4 8.1.5 8.1.5.1 8.1.5.2 8.1.5.3 8.2 8.2.1 8.2.2 9 10 11 12 13 14 14.1 14.1.1 14.1.2 14.1.3 15 16
SAA2501
Speed limitations of the L3 interface Default item data values after reset APPENDIX Preliminary specification 3-line `L3' interface Introduction Addressing mode Special function operational address Data mode Halt mode Device interface reset Extended addressing Operational address declaration Operational address invalidation Example of a data transfer Timing requirements Addressing mode Data mode Halt mode SAA2501 L3 protocol enhancement options Testing L3RDY by polling L3DATA Options to increase the timing accuracy of the APU coefficient writing LIMITING VALUES DC CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Plastic quad flat-packs By wave By solder paste reflow Repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) DEFINITIONS LIFE SUPPORT APPLICATIONS
January 1995
2
Philips Semiconductors
Preliminary specification
Digital Audio Broadcast (DAB) decoder
1 FEATURES 2 APPLICATION
SAA2501
· Advanced error protection · Integrated audio post processing for control of signal level and inter-channel crosstalk · Demultiplexing of Program Associated Data (PAD) in the input bitstream · Automatic digital de-emphasis of the decoded audio signal · Separate master and slave inputs · Automatic sample frequency and bit-rate switching in master input mode · Automatic synchronization of input and output interface clocks in master input mode · Selectable audio output precision; 16, 18, 20 or 22 bit · Low power consumption · Decoded sub-band signal and error flag outputs for error concealment. 4 ORDERING INFORMATION
· Digital Audio Broadcast systems as defined in "Eureka 147". 3 GENERAL DESCRIPTION
The SAA2501 audio source decoder supports ISO/IEC MPEG layers I and II and all DAB specific features as described in "Eureka 147 draft specification (EU147)".
PACKAGE TYPE NUMBER NAME SAA2501H Note 1. When using IR reflow soldering it is recommended that the Drypack instructions in the "Quality Reference Handbook" (order number 9398 510 63011) are followed. Supply of this "ISO/IEC 11172-3" audio standard Layer I or layer II compatible IC does not convey a licence nor imply a right under any patent, or any Industrial or Intellectual Property Right, to use this IC in any ready-to-use electronic product. QFP44(1) DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 × 10 × 1.75 mm VERSION SOT307-2
January 1995
3
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