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Part: 06F9758
Category:
Discrete
-> Diodes & Rectifiers
Description: Diode Schottky 2x10a
Company:
Datasheet: Download 06F9758 datasheet File size : 214 kB
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MOTOROLA
Designer's
SEMICONDUCTOR TECHNICAL DATA
Order this document by MBRB2060CT/D
TM Data Sheet SWITCHMODETM Power
· · · · · · · · ·
D2PAK Surface Mount Power Package
Rectifier
MBRB2060CT
Motorola Preferred Device
Employs the use of the Schottky Barrier principle with a platinum barrier metal. These stateoftheart devices have the following features: Package Designed for Power Surface Mount Applications CenterTap Configuration Guardring for Stress Protection Low Forward Voltage 150°C Operating Junction Temperature Epoxy Meets UL94, VO at 1/8 Guaranteed Reverse Avalanche Short Heat Sink Tab Manufactured -- Not Sheared! Similar in Size to Industry Standard TO220 Package SCHOTTKY BARRIER RECTIFIER 20 AMPERES 60 VOLTS
4 1 4 1 3 CASE 418B02
Mechanical Characteristics 3 · Case: Epoxy, Molded · Weight: 1.7 grams (approximately) · Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable · Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds · Shipped 50 units per plastic tube · Available in 24 mm Tape and Reel, 800 units per 13 reel by adding a "T4" suffix to the part number · Marking: B2060T MAXIMUM RATINGS, PER LEG
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR) TC = 110°C Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 100°C Non-repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz) Storage Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR) Total Device IFRM IFSM IRRM Tstg TJ dv/dt Symbol VRRM VRWM VR IF(AV)
Value 60
Unit Volts
10 20 20 150 0.5 65 to +175 65 to +150 10000
Amps Amps Amps Amp °C °C V/µs
THERMAL CHARACTERISTICS, PER LEG
Thermal Resistance -- Junction to Case -- Junction to Ambient (1) (1) See Chapter 7 for mounting conditions
Designer's Data for "Worst Case" Conditions -- The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves -- representing boundaries on device characteristics -- are given to facilitate "worst case" design.
RJC RJA
2.0 50
°C/W
Designer's and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1
©RectifierInc. 1996 Data Motorola, Device
1
MBRB2060CT
ELECTRICAL CHARACTERISTICS, PER LEG
Rating Maximum Instantaneous Forward Voltage (2) (iF = 20 Amps, TJ = 125°C) (iF = 20 Amps, TJ = 25°C) Maximum Instantaneous Reverse Current (2) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) (2) Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%. Symbol vF 0.85 0.95 iR 150 0.15 mA Value Unit Volts
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
50 I R, REVERSE CURRENT (mA) 20 10 5 3 TJ = 25°C 150°C 10 TJ = 125°C TJ = 100°C 1 175°C 100°C TJ = 150°C
0.1
1 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.9 1
0.01 0 20
TJ = 25°C 40 60 80 100 VR, REVERSE VOLTAGE (VOLTS) 120
Figure 1. Typical Forward Voltage Per Diode
Figure 2. Typical Reverse Current Per Diode
I F(AV), AVERAGE FORWARD CURRENT (AMPS)
32 28 24 20 16 12 8 4 0 80 90 100 110 120 130 140 TC, CASE TEMPERATURE (°C) 150 160 SQUARE WAVE RJC = 2°C/W RATED VOLTAGE APPLIED
20 18 AVERAGE POWER (WATTS) 16 14 12 10 8 6 4 2 0 0 2 4 IPK/IAV = 20 IPK/IAV = 10 TJ = 125°C
IPK/IAV = 5 PI
DC
SQUARE WAVE DC
6 8 10 12 14 AVERAGE CURRENT (AMPS)
16
18
20
Figure 3. Typical Current Derating, Case, Per Leg
Figure 4. Average Power Dissipation and Average Current
2
Rectifier Device Data
MBRB2060CT
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface
0.74 18.79
between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.065 1.651 0.420 10.66 0.07 1.78 0.14 3.56
inches mm
0.330 8.38
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(max) TA RJ A The 50°C/W for the D2PAK package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.5 watts. There are other alternatives to achieving higher power dissipation from the D2PAK package. One is to increase the area of the drain pad. By increasing the area of the drain pad, the power dissipation can be increased. Although one can almost double the power dissipation with this method, one will be giving up area on the printed circuit board which can defeat the purpose of using surface mount technology. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.5 watts. PD = 150°C 25°C = 2.5 watts 50°C/W
Rectifier Device Data
3
MBRB2060CT
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. · Always preheat the device. · The delta temperature between the preheat and soldering should be 100°C or less.* · When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. · The soldering temperature and time shall not exceed 260°C for more than 5 seconds.
· When shifting from preheating to soldering, the maximum · After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. · Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * Due to shadowing and the inability to set the wave height to incorporate other surface mount components, the D2PAK is not recommended for wave soldering. temperature gradient shall be 5°C or less.
TYPICAL SOLDERING HEATING PROFILE
For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 5 shows a typical heating profile for use when soldering the D2PAK to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on
STEP 1 PREHEAT ZONE 1 "RAMP" 200°C DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150°C 150°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) 160°C STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP"
the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 4 HEATING ZONES 3 & 6 "SOAK" STEP 5 HEATING ZONES 4 & 7 "SPIKE" 170°C STEP 6 VENT STEP 7 COOLING
205° TO 219°C PEAK AT SOLDER JOINT
100°C 100°C
140°C
DESIRED CURVE FOR LOW MASS ASSEMBLIES 50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 5. Typical Solder Heating Profile for D2PAK
4
Rectifier Device Data
MBRB2060CT
PACKAGE DIMENSIONS
C E B
4
V
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 14.60 15.88 1.14 1.40
A
1 2 3
S
T
SEATING PLANE
K G D H
3 PL M
J
DIM A B C D E G H J K S V
0.13 (0.005)
T
CASE 418B02 ISSUE B
STYLE 3: PIN 1. 2. 3. 4.
ANODE CATHODE ANODE CATHODE
Rectifier Device Data
5
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